Lightspring Raises €3.1 Million in Seed Funding
Lightspring, a French startup specializing in the design and fabrication of 3D optical interconnects for photonic integrated circuits, has successfully raised €3.1 million in a seed funding round. The round was led by Atlantic and OVNI Capital, with participation from Concept Ventures, Ixcore, Plug and Play Ventures, and Industry Business Angels.
Company Background
Based in Besançon, Bourgogne-franche-comté, France, Lightspring utilizes Two-Photon Polymerization to create optical interfaces that facilitate chip-to-chip, fiber-to-chip coupling, and beam shaping. The technology aims to address bottlenecks in photonic chip manufacturing, a process that constitutes a significant portion of the overall cost of photonic chips.
Founders and Leadership
The company was co-founded by Adria Grabulosa, who serves as the Chief Technology Officer, and Gregoire Bonnat, who holds the position of Chief Executive Officer. Grabulosa and Bonnat bring expertise from their research at FEMTO-ST / CNRS, which underpins Lightspring's innovative approach to photonic technology.
Strategic Use of Funds
The newly raised capital will be directed towards scaling up production capabilities and enhancing the development of their 3D optical interconnects. The funds will also support efforts to tackle existing manufacturing challenges, thereby reducing costs and improving efficiency in the photonic chip industry.
Investor Confidence
The involvement of prominent investors like Atlantic, OVNI Capital, and others underscores the growing interest in photonic technology as a pivotal component of future technological advancements. The funding will enable Lightspring to accelerate its research and development efforts, bringing more efficient solutions to the market.
For more information about their innovative technology solutions and future plans, visit Lightspring's official website.