Lightspring designs and fabricates 3D optical interconnects for photonic integrated circuits using Two-Photon Polymerization. Their technology supports chip-to-chip and fiber-to-chip coupling and beam shaping, addressing challenges in photonic chip manufacturing.
Total Funding
$1M+
Total Rounds
1
First Raise
Sep 22, 2026
Latest Raise
Sep 22, 2026
New funding rounds in your inbox every week 路 No noise, all Signal.
Founders and leadership hierarchy for this company.
| Date | Deal Type | Amount | Lead Investor |
|---|---|---|---|
| 9/22/2026 | |||
Upgrade to Premium to view Capital Momentum Score and performance metrics
New funding rounds in your inbox every week 路 Free